电子行业:碳化硅材料有望应用于先进封装 打开成长空间

东方证券
Sep 07, 2025

事件:根据行家说三代半公众号信息,英伟达计划在新一代GPU 芯片的先进封装环节中采用碳化硅衬底,作为中介层材料。根据集邦化合物半导体公众号信息,台积电正计划将12 英寸单晶碳化硅应用于散热载板,取代传统的氧化铝、蓝宝石基板或陶瓷基板。我们的观点:碳化硅材料在先进封装中具备较高应用潜力,有望打开产业成长空间。部分投资者认为,由于碳化硅车型在新能源车领域的渗透率逐步迈向较高水平等原因,碳化硅材料未来...

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