英伟达与硅光子共封装:从 Spectrum-X 到跨站点 AI 网络的演进 | HotChips2025

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Sep 05, 2025

芝能智芯出品在 2025 年 Hot Chips 大会上,英伟达讲了在硅光子共封装(CPO)方向的最新进展。通过在 Spectrum-X 交换机和相关互连架构中引入硅光子学,英伟达试图解决大规模 AI 训练和数据中心网络中的抖动、功耗和扩展性问题。强调了低抖动通信对于 AI 作业的重要性,还展示了可扩展至多站点的 Spectrum-XGS 架构,提出了横向扩展和距离感知调度的新方法。Part 1硅...

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