9月4日消息,随着人工智能(AI)计算带来更高的热能负荷,现有散热材料已难以满足需求,导致芯片性能下滑。 据台媒报道,近期半导体业界传出消息称,台积电正广发“英雄帖”,号召设备厂与化合物半导体相关厂商参与,计划将12英单晶碳化硅(SiC)应用于散热载板,取代传统的氧化铝、蓝宝石基板或陶瓷基板。过去SiC主要应用在功率元件(Power Devices)、车用及储能领域,如今已进入新的发展阶段,例如在...
Source Link9月4日消息,随着人工智能(AI)计算带来更高的热能负荷,现有散热材料已难以满足需求,导致芯片性能下滑。 据台媒报道,近期半导体业界传出消息称,台积电正广发“英雄帖”,号召设备厂与化合物半导体相关厂商参与,计划将12英单晶碳化硅(SiC)应用于散热载板,取代传统的氧化铝、蓝宝石基板或陶瓷基板。过去SiC主要应用在功率元件(Power Devices)、车用及储能领域,如今已进入新的发展阶段,例如在...
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