设备链“隐形推手”看旺!半导体展抢先看

爱集微
Sep 06, 2025

SEMI报告指出,2025 Q1全球半导体设备出货额达320.5亿美元,年增21%,由AI、云端、高效运算与边缘应用强力带动,Rubin芯片Tape out的影响将反映在9月10-12日的SEMICON Taiwan 2025,展览聚焦在AI芯片、先进封装、3DIC、Chiplet、FOPLP、异质整合、硅光子、量子运算、HBM高频宽记忆体等项目,其中AI时代所需的复杂设计、先进封装与异质整合方案...

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