全球光芯片战场现分化:一边巨资碾压,一边ALL IN攻坚

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Sep 12

1、全球光通信芯片企业研发投入分化:博通单季超23亿美元,长光华芯占比达46.69%2、一期投资20亿元 亚芯电子6英寸硅基芯片生产项目签约福建3、迈特芯完成Pre-A轮融资,系边端侧AI芯片研发商4、具身智能自变量机器人完成近10亿元A+轮融资,阿里云等领投5、赛迈测控完成近亿元A轮融资,系半导体射频测试设备商1、全球光通信芯片企业研发投入分化:博通单季超23亿美元,长光华芯占比达46.69%...

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