昨天介绍了PCB材料,今天再介绍下半导体材料。驱动逻辑随着AI算力、智能驾驶、数据中心等高端应用对芯片性能要求不断提升,推动先进制程产能加速扩张。3D NAND、GAA晶体管等新技术需更多工艺步骤,直接带动硅晶圆、湿化学品、CMP抛光液/垫、光刻胶等材料用量增长,机构预测2028年全球12英寸晶圆月产能将达1110万片,CAGR约7%,其中先进制程产能CAGR高达14%。中国大陆作为全球主要扩产...
Source Link昨天介绍了PCB材料,今天再介绍下半导体材料。驱动逻辑随着AI算力、智能驾驶、数据中心等高端应用对芯片性能要求不断提升,推动先进制程产能加速扩张。3D NAND、GAA晶体管等新技术需更多工艺步骤,直接带动硅晶圆、湿化学品、CMP抛光液/垫、光刻胶等材料用量增长,机构预测2028年全球12英寸晶圆月产能将达1110万片,CAGR约7%,其中先进制程产能CAGR高达14%。中国大陆作为全球主要扩产...
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