台积电与英伟达布局碳化硅材料应用

DoNews
Sep 12, 2025

近日,台积电被曝号召设备厂与化合物半导体厂商参与其12英寸单晶碳化硅(SiC)散热载板研发计划,拟取代传统氧化铝、蓝宝石或陶瓷基板。与此同时,英伟达也计划在新一代GPU芯片的先进封装中采用碳化硅衬底作为中介层材料。此举或将推动碳化硅材料在高性能芯片领域的广泛应用。

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