据《日经新闻》9月9日报导，索尼半导体解决方案（Sony Semiconductor Solutions，以下简称“索尼半导体”）社长指田慎二接受受访表示，索尼面向智能手机的次世代CMOS图像感测器将在2029年度出货。据介绍，索尼半导体研发的次世代CMOS感测器将采用3层结构（目前产品为2层）、22-28纳米制程（目前为40纳米），借此在尺寸不变下，提高感度、分辨率、读取速度等性能。报导指出，...
Source Link据《日经新闻》9月9日报导，索尼半导体解决方案（Sony Semiconductor Solutions，以下简称“索尼半导体”）社长指田慎二接受受访表示，索尼面向智能手机的次世代CMOS图像感测器将在2029年度出货。据介绍，索尼半导体研发的次世代CMOS感测器将采用3层结构（目前产品为2层）、22-28纳米制程（目前为40纳米），借此在尺寸不变下，提高感度、分辨率、读取速度等性能。报导指出，...
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