智通财经APP获悉，天岳先进(02631)涨近5%，截至发稿，涨4.75%，报50.7港元，成交额1.12亿港元。
消息面上，据报道，近期，中国科学院半导体研究所科技成果转化企业北京晶飞半导体科技在碳化硅晶圆加工技术领域取得重大突破，成功利用自主研发的激光剥离设备实现了12英寸碳化硅晶圆的剥离。该突破标志着中国在第三代半导体关键制造装备领域迈出重要一步，为全球碳化硅产业的降本增效提供了全新解决方案。此前，有报道称，英伟达计划在新一代GPU芯片的先进封装环节中采用碳化硅衬底。
天岳先进半年报显示，公司自成立以来即专注于高品质碳化硅衬底的研发与产业化。公司是全球少数能够实现8英寸碳化硅衬底量产、率先实现2英寸到8英寸碳化硅衬底的商业化的公司之一，也是率先推出12英寸碳化硅衬底的公司。东方证券认为，碳化硅材料在高端算力芯片中的应用潜力尚未完全挖掘。未来，碳化硅材料有望应用于算力芯片的先进封装等环节，打开产业成长空间。
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