9月16日，苹果公司首席执行官蒂姆·库克公开表示，半导体封装企业艾马克技术将协助苹果推进芯片封装业务及供应链回流计划。消息刺激艾马克技术股价盘前大涨，截至发稿涨超8%。
库克在采访中透露，晶圆后续将送往得克萨斯州的环球晶圆，为台积电等企业供货，台积电负责芯片晶圆制造；随后，位于亚利桑那州的艾马克技术将承担芯片封装工作。同时，应用材料公司在半导体设备领域也发挥关键作用。库克表示，苹果正推动整个半导体产业链实现端到端的美国本土化。
此外，艾马克技术本月早些时候完成了一笔总额5亿美元的高级债券发行，票面利率为5.875%，到期日为2033年。
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