AI需求+中国补贴双轮驱动,台积电(TSM.US)Q2市占率跃升至38%独占鳌头

智通财经
Sep 16, 2025

智通财经APP获悉,根据Counterpoint Research数据,台积电(TSM.US)在2025年自然年第二季度半导体代工市场占有率飙升至38%,同比提升7个百分点,而去年同期为31%。这一增长源于行业整体晶圆代工收入同比攀升19%,主要受人工智能对先进制程及封装技术的强劲需求驱动,同时中国补贴政策引发的提前拉货效应亦贡献显著。Counterpoint预测,2025年第三季度晶圆代工收入将延续增长态势,实现中等个位数增幅。

Counterpoint高级分析师William Li指出,随着先进封装技术在芯片性能提升中的关键作用日益凸显,芯片设计商将日益依赖先进封装来提升方案性能。鉴于台积电目前的技术领先优势及稳固的客户关系,预计该公司不仅在先进制程节点领域持续领跑,未来在先进封装领域也将保持主导地位。

从同业对比看,第二季度多数其他晶圆代工厂商(含 IDM 外包份额)市场份额维持或微降:德州仪器(TXN.US)与英特尔(INTC.US)均稳定保持6%市场份额;英飞凌科技从6%微降至5%,三星则从5%下滑至4%。

Counterpoint高级分析师Jake Lai分析,消费电子传统旺季效应、AI 应用订单加速及中国现有补贴政策,将成为三季度主要驱动力。

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