(信息来源:chosun)SEMECS、韩华半导体和韩美半导体三家公司在高带宽存储器(HBM)核心半导体设备TC键合机(TC Bonder)的竞争中处于白热化阶段,目前正加速混合键合机的量产准备工作,预计该设备将从第六代HBM(HBM4)生产开始部分采用。三星电子和SK海力士已进行HBM4的量产测试,目前的关键在于设备价格(比现有TC键合机高出两倍以上)以及与美国和荷兰制造的设备相比,能否确保技术...
Source Link(信息来源:chosun)SEMECS、韩华半导体和韩美半导体三家公司在高带宽存储器(HBM)核心半导体设备TC键合机(TC Bonder)的竞争中处于白热化阶段,目前正加速混合键合机的量产准备工作,预计该设备将从第六代HBM(HBM4)生产开始部分采用。三星电子和SK海力士已进行HBM4的量产测试,目前的关键在于设备价格(比现有TC键合机高出两倍以上)以及与美国和荷兰制造的设备相比,能否确保技术...
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