消息称三星电子12层堆叠HBM3E芯片产品通过英伟达测试

格隆汇
Sep 19

格隆汇9月19日|市场消息称,三星电子12层堆叠HBM3E芯片产品最近通过了英伟达的认证测试。三星在完成该芯片研发约18个月后获得了通过。

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