1.新思科技中国30周年引领AI智能体工程师重塑芯片设计范式;2.泽石科技完成C+轮融资,加速存储国产化进程;3.磐盟半导体完成近亿元A轮融资,系国产超纯刻蚀硅材料企业;4.半导体IP上市公司半年报:把握AI机遇 强化研发布局;5.利普芯智能芯片封装测试产业化项目装修开工 明年Q2正式投产;1.新思科技中国30周年引领AI智能体工程师重塑芯片设计范式;2025年9月18日,新思科技中国30周年暨...
Source Link1.新思科技中国30周年引领AI智能体工程师重塑芯片设计范式;2.泽石科技完成C+轮融资,加速存储国产化进程;3.磐盟半导体完成近亿元A轮融资,系国产超纯刻蚀硅材料企业;4.半导体IP上市公司半年报:把握AI机遇 强化研发布局;5.利普芯智能芯片封装测试产业化项目装修开工 明年Q2正式投产;1.新思科技中国30周年引领AI智能体工程师重塑芯片设计范式;2025年9月18日,新思科技中国30周年暨...
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