联发科天玑9500芯片发布 台积电3nm打造 性能提升32%

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【CNMO科技消息】9月22日下午,联发科正式发布新一代旗舰移动平台天玑9500。天玑9500采用台积电第三代3nm制程(N3P工艺),集成超过300亿个晶体管,搭载Arm全新架构,首次推出“第三代全大核”CPU设计,由1颗主频高达4.21GHz的C1-Ultra超大核、3颗3.5GHz的C1-Premium大核及4颗2.7GHz的C1-Pro能效核组成,配备16MB三级缓存和10MB系统缓存,...

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