大家都清楚，在芯片生产的三大环节，也就是设计、制造、封测这项中，设计、封测水平我们是与全球顶尖水平同步的，目前都达到了3nm的水平。但制造却落后很多，虽然之前只公开了14nm，但实际上应该在等效7nm左右，而考虑到三星、台积电今年要量产2nm了，中间还差了5nm，3nm，所以实际相差三代。很多人对于相差3代这个事，一直耿耿于怀，觉得这样差距太大，肯定会被卡脖子，我们必须将工艺提升上来才行。当然，...
Source Link大家都清楚，在芯片生产的三大环节，也就是设计、制造、封测这项中，设计、封测水平我们是与全球顶尖水平同步的，目前都达到了3nm的水平。但制造却落后很多，虽然之前只公开了14nm，但实际上应该在等效7nm左右，而考虑到三星、台积电今年要量产2nm了，中间还差了5nm，3nm，所以实际相差三代。很多人对于相差3代这个事，一直耿耿于怀，觉得这样差距太大，肯定会被卡脖子，我们必须将工艺提升上来才行。当然，...
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