消息称地平线明年计划推舱驾一体芯片

车质网
Sep 22

9月19日,有媒体爆料称,国产智驾方案商地平线计划于2026年发布新一代面向整车智能的舱驾一体芯片,并在明年内实现量产。这款芯片被描述为地平线历史上设计最复杂的一款,由地平线副总裁兼首席架构师苏箐及其团队参与算力定义与规划,从软件算法需求出发,倒推芯片设计,这已成为智驾芯片领域的主流开发模式。地平线已与全球超40家车企及品牌达成合作,合作车型超400款,成为超600万车主之选。市场上每三台智能汽车...

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