感谢IT之家网友 Snailwang 的线索投递!IT之家 9 月 24 日消息,微软昨日(9 月 23 日)发布博文,宣布突破 AI 芯片散热瓶颈,创新研发芯内微流体冷却系统,散热效率可达目前最先进散热技术冷板(cold plates)三倍。IT之家注:冷板是一种传统液冷方式,冷板贴在芯片表面,通过板内通道循环冷液吸热,但由于隔着多层材料,限制了散热能力。芯内微流体冷却系统则移除这些“隔热层”,...
Source Link感谢IT之家网友 Snailwang 的线索投递!IT之家 9 月 24 日消息,微软昨日(9 月 23 日)发布博文,宣布突破 AI 芯片散热瓶颈,创新研发芯内微流体冷却系统,散热效率可达目前最先进散热技术冷板(cold plates)三倍。IT之家注:冷板是一种传统液冷方式,冷板贴在芯片表面,通过板内通道循环冷液吸热,但由于隔着多层材料,限制了散热能力。芯内微流体冷却系统则移除这些“隔热层”,...
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