台积电(TSM.US)盘前涨超2.3%，报279美元，开盘后股价势将再创新高。 消息面上，业内传闻称，台积电第三代3nm制程(N3P)的代工价格先比前代的N3E制程上涨了约20%，而台积电明年将对外供应的2nm制程的代工价格还将上涨50%。美国半导体设备大厂科磊公司高管近期透露，台积电2nm制程目前已经获得了15个客户，其中10家是面向HPC应用的客户，其余的应该是手机芯片客户。 此外，花旗发表研报指，在英伟达和英特尔合作后，台积电可能仍将是这两家公司的主要代工方。英伟达8月份证实，台积电正为其下一代Rubin架构生产六款新芯片。花旗分析师预计，任何潜在的英伟达-英特尔联合开发的产品在未来几年将继续依赖台积电的技术。他们预测，到2026年，台积电来自英伟达的收入将增长50%，来自英特尔的收入将增长20%。(格隆汇)
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