东材科技:乘AI东风 发力碳氢树脂

华泰证券股份有...
Sep 25

25 年以来,海外AI 巨头英伟达陆续推出Rubin 系列并预计于26 年开始放量,博通于25Q3 业绩会上亦表示出ASIC 芯片未来的高景气。未来几年AI 芯片仍将向更先进的方向高速发展,我们测算出上游高频高速树脂全球市场规模25-27 年CAGR 有望达42%,碳氢树脂有望凭借更低的Dk 及Df值成为M9 级别主流树脂之一。东材科技作为国内碳氢树脂等领先企业,与下游高速CCL 龙头企业台光电子...

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