天眼查App显示,2025-09-26,“封装结构和滤波器”(patentName)正式进入专利的公布阶段。申请人为中芯国际集成电路制造(北京)有限公司,中芯国际集成电路制造(上海)有限公司,该项电子电路专利涉及谐振单元集成化封装技术的应用场景。据专利信息显示,通过在顶部电极顶面设置位于有效谐振区的第一空腔,显著优化了封装结构的纵向尺寸控制效果。发明人为丁焱昆;孙静。一种封装结构和滤波器,封装结构...
Source Link天眼查App显示,2025-09-26,“封装结构和滤波器”(patentName)正式进入专利的公布阶段。申请人为中芯国际集成电路制造(北京)有限公司,中芯国际集成电路制造(上海)有限公司,该项电子电路专利涉及谐振单元集成化封装技术的应用场景。据专利信息显示,通过在顶部电极顶面设置位于有效谐振区的第一空腔,显著优化了封装结构的纵向尺寸控制效果。发明人为丁焱昆;孙静。一种封装结构和滤波器,封装结构...
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