高通(QCOM.US) 中国区董事长孟朴在2025骁龙峰会期间表示，看好智能汽车、机器人及智能眼镜等新兴市场，并认为中国新能源车企的“中国速度”为高通带来挑战与机遇。他称，高通近三年已支持210多款全球车型，预期机器人与可穿戴设备的市场规模未来有望媲美智能手机，高通将以平台化策略持续探索，并推动技术落地。
高通在中国三十年的发展可用“创新与合作”概括。对于苹果(AAPL.US) 、小米(01810.HK) 等厂商自研芯片，他认为不影响合作，高通通用芯片具备规模优势。孟朴指出，真正的人工智能尚未到来，现有应用仍属初级，未来AI必须落地到端侧，以保障隐私并提供即时响应，高通已在骁龙芯片中强化相关算力。(me/s)(港股报价延迟最少十五分钟。沽空资料截至 2025-09-24 16:25。) (美股为即时串流报价； OTC市场股票除外，资料延迟最少15分钟。)
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