攻破CUDA护城河,英伟达挑战者融资18亿

半导体行业观察
Sep 25

公众号记得加星标⭐️,第一时间看推送不会错过。来源:内容来自半导体行业观察综合。人工智能初创公司 Modular Inc.今天表示,其在第三轮融资中筹集了 2.5 亿美元(约18亿人民币),公司估值达到 16 亿美元。此轮融资由 Thomas Tull 的美国创新科技基金领投,DFJ Growth 跟投。所有现有投资者均参与了此轮融资,包括 Google Ventures、General ...

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