据科技新报消息,全球半导体产业迈入人工智能(AI)与高效能运算(HPC)驱动的新时代,散热管理正逐渐成为影响芯片设计与制程能否突破的核心瓶颈。当3D堆叠、2.5D整合等先进封装架构持续推升芯片密度与功耗,传统陶瓷基板已难以满足热通量需求。晶圆代工龙头台积电正以一项大胆的材料转向回应这一挑战,那就是全面拥抱12英寸碳化硅(SiC)单晶基板,并逐步退出氮化镓(GaN)业务。此举不仅象征台积电在材料战略...
Source Link据科技新报消息,全球半导体产业迈入人工智能(AI)与高效能运算(HPC)驱动的新时代,散热管理正逐渐成为影响芯片设计与制程能否突破的核心瓶颈。当3D堆叠、2.5D整合等先进封装架构持续推升芯片密度与功耗,传统陶瓷基板已难以满足热通量需求。晶圆代工龙头台积电正以一项大胆的材料转向回应这一挑战,那就是全面拥抱12英寸碳化硅(SiC)单晶基板,并逐步退出氮化镓(GaN)业务。此举不仅象征台积电在材料战略...
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