盖世汽车讯 9月24日,新思科技(Synopsys)宣布与台积电(TSMC)继续合作,提供涵盖先进EDA和IP产品在内的多裸片解决方案,支持台积电领先的工艺和封装技术,推动人工智能(AI)芯片和多裸片设计的创新。图片来源: 新思科技3DIC Compiler从探索到签核(exploration-to-signoff)的平台和IP专为3D封装优化,加上新思科技与台积电在设计赋能方面的合作,已促成多个...
Source Link盖世汽车讯 9月24日,新思科技(Synopsys)宣布与台积电(TSMC)继续合作,提供涵盖先进EDA和IP产品在内的多裸片解决方案,支持台积电领先的工艺和封装技术,推动人工智能(AI)芯片和多裸片设计的创新。图片来源: 新思科技3DIC Compiler从探索到签核(exploration-to-signoff)的平台和IP专为3D封装优化,加上新思科技与台积电在设计赋能方面的合作,已促成多个...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.