新思科技携手台积电 推动下一波人工智能和多芯片创新浪潮

盖世汽车
Sep 29

盖世汽车讯 9月24日,新思科技(Synopsys)宣布与台积电(TSMC)继续合作,提供涵盖先进EDA和IP产品在内的多裸片解决方案,支持台积电领先的工艺和封装技术,推动人工智能(AI)芯片和多裸片设计的创新。图片来源: 新思科技3DIC Compiler从探索到签核(exploration-to-signoff)的平台和IP专为3D封装优化,加上新思科技与台积电在设计赋能方面的合作,已促成多个...

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