金吾财讯 | 中信建投发研报指，算力供应紧张，AI有望引领下一轮周期成长。英伟达GB200、CSP自研ASIC放量，下一代GB300即将量产，同时HBM4/4e也将落地，算力硬件快速迭代。AI算力加速了对先进制程、先进封装、先进存储的需求，以GPU、CoWoS/SoIC、HBM、高速PCB、光模块为代表的算力需求持续扩张，供应商大力扩产，预计2025年AI硬件产业维持高景气。建议关注国内自主算力芯片及先进封装标的。
金吾财讯 | 中信建投发研报指，算力供应紧张，AI有望引领下一轮周期成长。英伟达GB200、CSP自研ASIC放量，下一代GB300即将量产，同时HBM4/4e也将落地，算力硬件快速迭代。AI算力加速了对先进制程、先进封装、先进存储的需求，以GPU、CoWoS/SoIC、HBM、高速PCB、光模块为代表的算力需求持续扩张，供应商大力扩产，预计2025年AI硬件产业维持高景气。建议关注国内自主算力芯片及先进封装标的。
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