BRIEF-Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In Arizona

Reuters

Oct 07

Oct 6 (Reuters) - Amkor Technology Inc AMKR.O:

AMKOR TECHNOLOGY BREAKS GROUND ON NEW SEMICONDUCTOR ADVANCED PACKAGING AND TEST CAMPUS IN ARIZONA; EXPANDS INVESTMENT TO $7 BILLION
AMKOR TECHNOLOGY INC - FIRST FACILITY COMPLETION EXPECTED MID-2027, PRODUCTION IN 2028
AMKOR TECHNOLOGY INC - INVESTMENT SUPPORTED BY CHIPS FOR AMERICA PROGRAM AND TAX CREDITS, STATE AND LOCAL GOVERNMENTS
AMKOR TECHNOLOGY INC: EXPANDED INVESTMENT INCLUDES ADDITIONAL CLEANROOM SPACE AND A SECOND GREENFIELD PACKAGING AND TEST FACILITY

Source text: ID:nBw69D8dya

Further company coverage: AMKR.O

((Reuters.Briefs@thomsonreuters.com;))

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EXPANDS INVESTMENT TO $7 BILLION</p></li><li><p>AMKOR TECHNOLOGY INC - FIRST FACILITY COMPLETION EXPECTED MID-2027, PRODUCTION IN 2028</p></li><li><p>AMKOR TECHNOLOGY INC - INVESTMENT SUPPORTED BY CHIPS FOR AMERICA PROGRAM AND TAX CREDITS, STATE AND LOCAL GOVERNMENTS</p></li><li><p>AMKOR TECHNOLOGY INC: EXPANDED INVESTMENT INCLUDES ADDITIONAL CLEANROOM SPACE AND A SECOND GREENFIELD PACKAGING AND TEST FACILITY</p></li></ul><p>Source text: <span>ID:nBw69D8dya</span></p><p>Further company coverage: <span>AMKR.O</span></p><p> ((Reuters.Briefs@thomsonreuters.com;))</p></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>BRIEF-Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In Arizona</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; 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}\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nBRIEF-Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In Arizona\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1032215980\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Reuters </p>\n<p class=\"h-time\">2025-10-07 06:03</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html xmlns=\"http://www.w3.org/1999/xhtml\"><head><title>BRIEF-Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In Arizona</title></head><body><p><span>Oct 6 (Reuters)</span><span> - </span>Amkor Technology Inc <span>AMKR.O</span>:</p><ul><li><p>AMKOR TECHNOLOGY BREAKS GROUND ON NEW SEMICONDUCTOR ADVANCED PACKAGING AND TEST CAMPUS IN ARIZONA; EXPANDS INVESTMENT TO $7 BILLION</p></li><li><p>AMKOR TECHNOLOGY INC - FIRST FACILITY COMPLETION EXPECTED MID-2027, PRODUCTION IN 2028</p></li><li><p>AMKOR TECHNOLOGY INC - INVESTMENT SUPPORTED BY CHIPS FOR AMERICA PROGRAM AND TAX CREDITS, STATE AND LOCAL GOVERNMENTS</p></li><li><p>AMKOR TECHNOLOGY INC: EXPANDED INVESTMENT INCLUDES ADDITIONAL CLEANROOM SPACE AND A SECOND GREENFIELD PACKAGING AND TEST FACILITY</p></li></ul><p>Source text: <span>ID:nBw69D8dya</span></p><p>Further company coverage: <span>AMKR.O</span></p><p> ((Reuters.Briefs@thomsonreuters.com;))</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"AMKR","symbol_name":"艾马克技术公司","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20251006:nTUAJDVRQ:1","article_id":"2573899819","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2573899819","pubTimestamp":1759788180,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"BRIEF-Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In ArizonaOct 6 (Reuters) - Amkor Technology Inc AMKR.O:AMKOR TECHNOLOGY BREAKS GROUND ON NEW SEMICONDUCTOR ADVANCED PACKAGING AN","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"AMKR":"艾马克技术公司","BK4147":"半导体设备","BK4543":"AI"},"translate_title":"简介-Amkor Tech在亚利桑那州破土动工开发新型半导体先进封装","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMKR":0.9},"content_text":"BRIEF-Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In ArizonaOct 6 (Reuters) - Amkor Technology Inc AMKR.O:AMKOR TECHNOLOGY BREAKS GROUND ON NEW SEMICONDUCTOR ADVANCED PACKAGING AND TEST CAMPUS IN ARIZONA; EXPANDS INVESTMENT TO $7 BILLIONAMKOR TECHNOLOGY INC - FIRST FACILITY COMPLETION EXPECTED MID-2027, PRODUCTION IN 2028AMKOR TECHNOLOGY INC - INVESTMENT SUPPORTED BY CHIPS FOR AMERICA PROGRAM AND TAX CREDITS, STATE AND LOCAL GOVERNMENTSAMKOR TECHNOLOGY INC: EXPANDED INVESTMENT INCLUDES ADDITIONAL CLEANROOM SPACE AND A SECOND GREENFIELD PACKAGING AND TEST FACILITYSource text: ID:nBw69D8dyaFurther company coverage: AMKR.O ((Reuters.Briefs@thomsonreuters.com;))","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"}}}