Amkor Breaks Ground on New Arizona Chip Packaging Campus With Federal Support

MT Newswires Live

Oct 07

Amkor Technology (AMKR) said late Monday it has broken ground on an expanded $7 billion semiconductor packaging and test campus in Arizona, developed in collaboration with the Trump administration.

The project, backed by federal, state, and local support through the CHIPS for America Program and the Advanced Manufacturing Investment Tax Credit, will be built in two phases and include additional cleanroom space and a second greenfield facility.

Amkor said the Arizona campus will include over 750,000 square feet of cleanroom space and create up to 3,000 jobs, with construction of the first manufacturing facility expected to finish by mid-2027 and production starting in early 2028.

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