公众号记得加星标⭐️,第一时间看推送不会错过。来源:本文编译自SEMI。国际半导体产业协会(SEMI)今日在其最新的《300毫米晶圆厂展望》中指出,预计2026年至2028年,全球300毫米晶圆厂设备支出将达到3740亿美元。这一强劲的投资反映了晶圆厂区域化以及数据中心和边缘设备对人工智能芯片需求的激增,同时也凸显了各主要地区通过本地化产业生态系统和供应链重组,对实现半导体自给自足的日益重视。预计...
Source Link公众号记得加星标⭐️,第一时间看推送不会错过。来源:本文编译自SEMI。国际半导体产业协会(SEMI)今日在其最新的《300毫米晶圆厂展望》中指出,预计2026年至2028年,全球300毫米晶圆厂设备支出将达到3740亿美元。这一强劲的投资反映了晶圆厂区域化以及数据中心和边缘设备对人工智能芯片需求的激增,同时也凸显了各主要地区通过本地化产业生态系统和供应链重组,对实现半导体自给自足的日益重视。预计...
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