图片来源：DIGITIMES为提升AI 计算所需的先进逻辑芯片与存储芯片性能，全球半导体设备巨头应用材料公司（Applied Materials）推出了全新半导体制造系统。该公司宣布了三款核心产品，聚焦 AI 芯片关键技术领域研发：集成式裸片对晶圆混合键合系统、基于全环绕栅极（GAA）晶体管的先进逻辑工艺、高带宽内存（HBM）DRAM，以及可优化芯片性能、功耗与成本的尖端封装技术。随着芯片复杂度...
Source Link图片来源：DIGITIMES为提升AI 计算所需的先进逻辑芯片与存储芯片性能，全球半导体设备巨头应用材料公司（Applied Materials）推出了全新半导体制造系统。该公司宣布了三款核心产品，聚焦 AI 芯片关键技术领域研发：集成式裸片对晶圆混合键合系统、基于全环绕栅极（GAA）晶体管的先进逻辑工艺、高带宽内存（HBM）DRAM，以及可优化芯片性能、功耗与成本的尖端封装技术。随着芯片复杂度...
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