炒股就看金麒麟分析师研报,权威,专业,及时,全面,助您挖掘潜力主题机会!(来源:环球网资讯)来源:环球网【环球网科技综合报道】10月11日消息,瑞银集团(UBS)近日发布最新分析师报告,对英伟达未来先进封装需求及产能格局作出重要预测。报告显示,受当前 Blackwell 系列芯片热销与下一代 Rubin AI 芯片订单拉动,英伟达 2026 年对 CoWoS(芯片晶圆级系统集成)先进封装的需求将...
Source Link炒股就看金麒麟分析师研报,权威,专业,及时,全面,助您挖掘潜力主题机会!(来源:环球网资讯)来源:环球网【环球网科技综合报道】10月11日消息,瑞银集团(UBS)近日发布最新分析师报告,对英伟达未来先进封装需求及产能格局作出重要预测。报告显示,受当前 Blackwell 系列芯片热销与下一代 Rubin AI 芯片订单拉动,英伟达 2026 年对 CoWoS(芯片晶圆级系统集成)先进封装的需求将...
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