全球都在扩产先进封装

半导体芯闻
Oct 11, 2025

如果您希望可以时常见面,欢迎标星 收藏哦~在摩尔定律趋缓、AI/HPC需求爆发的背景下,先进封装已成为晶圆代工厂与封测企业的必争之地。全球范围内,从台积电到三星,从日月光到安靠,以及国内的长电科技、通富微电、华天科技,几乎所有龙头厂商都在加快扩产,力争抢占这一未来数年最关键的产业高地。据 Coherent Market Insights (CMI) 数据,全球先进芯片封装市场规模预计将从 2025...

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