AI 热潮不退:瑞银预测英伟达 2026 年 CoWoS 晶圆需求激增 40%,台积电产能告急

IT之家
Oct 11, 2025

IT之家 10 月 11 日消息,瑞银集团(UBS)报告预测,受当前 Blackwell 及下一代 Rubin AI 芯片的强劲订单驱动,英伟达对 CoWoS 先进封装的需求将迎来大幅增长,预计到 2026 年,其 CoWoS 晶圆需求量将达到 67.8 万片,同比增长近 40%,GPU 总产量也将提升至 740 万颗。IT之家注:CoWoS 全称为 Chip-on-Wafer-on-...

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