证券日报网讯帝科股份10月16日发布公告,在公司回答调研者提问时表示,公司DRAM晶圆测试分选为特色技术工艺,可实现高效、精准测试且具有快速测试方案开发能力,主要根据基于终端应用需求确定的定制化测试方案通过定制全自动化测试设备将DRAM存储晶圆进行测试后分级分类,属于封装前的工艺制程。 海量资讯、精准解读,尽在新浪财经APP
Source Link证券日报网讯帝科股份10月16日发布公告,在公司回答调研者提问时表示,公司DRAM晶圆测试分选为特色技术工艺,可实现高效、精准测试且具有快速测试方案开发能力,主要根据基于终端应用需求确定的定制化测试方案通过定制全自动化测试设备将DRAM存储晶圆进行测试后分级分类,属于封装前的工艺制程。 海量资讯、精准解读,尽在新浪财经APP
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