AMD 首次公开静态展示下代机架级 AI 系统“Helios”,预计 2026 年批量部署

IT之家
Oct 15

IT之家 10 月 15 日消息,AMD 在美国加州举行的 2025 OCP 全球峰会上首次公开静态展示了其首个专为前沿 AI 工作负载设计的机架系统参考设计 "Helios"。"Helios" 系统采用 Meta 在本次会议上推出的 ORW“双宽”机架规范,这一形态针对下一代 AI 系统的电源、冷却和可维护性需求进行了优化。标准化加速了 "Helios" 系统的上市、部署、投运,也支持 OEM ...

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