台积电的CoWoS-L技术已引起NVIDIA的高度关注。作为3D Fabric平台的重要组成部分，CoWoS-L是CoWoS-S技术的延伸版本。其中，“L”代表局部硅互连（LSI），通过类似“硅桥”的技术，结合RDL中介层形成“重构中介层”。CoWoS-L技术凭借更高的布线密度和嵌入式深沟槽电容（eDTC），能够实现更大尺寸的高效运算（HPC）芯片异质整合。其光罩尺寸可达3.3倍以上，甚至向4倍、...
Source Link台积电的CoWoS-L技术已引起NVIDIA的高度关注。作为3D Fabric平台的重要组成部分，CoWoS-L是CoWoS-S技术的延伸版本。其中，“L”代表局部硅互连（LSI），通过类似“硅桥”的技术，结合RDL中介层形成“重构中介层”。CoWoS-L技术凭借更高的布线密度和嵌入式深沟槽电容（eDTC），能够实现更大尺寸的高效运算（HPC）芯片异质整合。其光罩尺寸可达3.3倍以上，甚至向4倍、...
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