未来三年,全球300毫米晶圆厂设备支出将突破3740亿美元

半导体新知道
Oct 15, 2025

国际半导体产业协会(SEMI)最新发布的《300毫米晶圆厂展望》报告显示,2026年至2028年,全球300毫米晶圆厂设备支出将累计达3740亿美元。这一数字不仅刷新行业纪录,更折射出,全球半导体产业在技术迭代与区域战略布局下的深度变革。从整体趋势看,2025年将成为关键起点,全球300毫米晶圆厂设备支出预计首次突破1000亿美元大关,同比增长7%至1070亿美元;随后三年将持续攀升,2026年...

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