新思科技与台积公司合作实现2D和3D设计解决方案

爱集微
Oct 16

新思科技近日宣布,其旗下的Ansys仿真和分析解决方案产品组合已通过台积公司认证,支持对面向台积公司最先进制造工艺(包括台积公司N3C、N3P、N2P和A16™)的芯片设计进行准确的最终验证检查。两家公司还就面向TSMC-COUPE™平台的AI辅助设计流程开展了合作。新思科技与台积公司共同赋能客户有效开展芯片设计,涵盖AI加速、高速通信和先进计算等一系列应用。多物理场和AI驱动的光子学设计支持...

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