旺!旺!先进封装火爆出圈,多家企业迎大单,忙扩产,台积电,日月光、京元电....

今日半导体
Oct 13

免责声明:文章归作者所有,转载仅为分享和学习使用,不做任何商业用途!内容如有侵权,请联系本部删除!(手机微信同号15150147049)今日半导体媒体报道,随着人工智能(AI)和高性能计算(HPC)领域需求持续强劲,半导体产业正迎来新一轮的发展机遇。不仅全球半导体代工巨头台积电明年先进封装产能已全面满载,其先进封装协力厂日月光投控、京元电等也纷纷迎来大额订单,正忙着进行扩产。今日半导体媒体了解到,...

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