据AXIOS，英伟达和台积电将宣布他们在美国完成的首枚晶圆，这枚晶圆未来将被制成用于人工智能的Blackwell芯片。这一里程碑代表了特朗普政府推动在美国建设AI技术的首批成果之一，也标志着美国在争夺人工智能未来控制权的竞争中迈出关键一步。英伟达创始人兼首席执行官黄仁勋周五参观了台积电在凤凰城的半导体制造工厂，宣布了这一进展。英伟达表示：“英伟达与台积电正在携手，在美国本土建设支撑全球AI工厂的基础设施。”英伟达与台积电在联合声明中称：“台积电亚利桑那工厂预计将创造数千个高科技岗位，并吸引广泛的供应商生态系统。”不过，虽然这枚晶圆是将关键芯片生产回流美国的重要第一步，但在美国芯片需求能够完全摆脱对海外公司和工厂依赖之前，还有很长的路要走。
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