魏哲家:台积电美国取得第二块用地

芯榜
Oct 17

先进封装 “晶圆代工 2.0” 战略台积电召开 2025 年 Q3 法说会,董事长魏哲家披露多项关键信息。先进封装业务占营收近 10%(以 Q3 近兆元营收计),是推出 “晶圆代工 2.0” 战略的重要原因。他还透露,美国竞争对手(法人认为是英特尔)是台积电客户,双方在先进制程与封装领域合作,技术用于其高阶产品,面对相关提问仅强调半导体需关注系统化性能。海外布局上,美国将建两座先进封装厂区,与...

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