天眼查App显示,2025-10-24,“功率模块、电路板组件、电控盒组件及电气设备”(patentName)正式进入公布阶段。申请人为海信家电集团股份有限公司,该项半导体技术专利涉及功率模块的结构设计与集成化应用,旨在提升模块在高温高负载环境下的工作可靠性。据专利信息显示,该功率模块通过驱动侧框架与基板焊盘的优化布局,实现PFC驱动芯片、功率芯片与温度传感器的高效协同,热管理性能与电气连接稳定性...
Source Link天眼查App显示,2025-10-24,“功率模块、电路板组件、电控盒组件及电气设备”(patentName)正式进入公布阶段。申请人为海信家电集团股份有限公司,该项半导体技术专利涉及功率模块的结构设计与集成化应用,旨在提升模块在高温高负载环境下的工作可靠性。据专利信息显示,该功率模块通过驱动侧框架与基板焊盘的优化布局,实现PFC驱动芯片、功率芯片与温度传感器的高效协同,热管理性能与电气连接稳定性...
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