中美日角逐!刻蚀设备两大演进方向

天天IC
Oct 23

集微网·爱集微APP,各大主流应用商店均可下载刻蚀技术作为半导体制造的核心工艺,承担着将光刻胶上的图形精确转移到晶圆表面薄膜的关键任务。随着芯片制程进入5nm、3nm及以下节点,以及FinFET、GAA等三维器件结构的普及,刻蚀技术的复杂性和重要性愈发凸显。在这一背景下,谁掌握了先进的刻蚀技术并构建了有效的专利壁垒,谁就能在全球半导体产业链中占据战略制高点。本文将从核心技术路径出发,系统分析中国、...

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