近日,光刻机巨头ASML在最新财报中宣布推出专用于3D集成的先进封装设备TWINSCAN XT:260,标志着其正式进军先进封装市场。该设备采用365nm i线光源,通过优化工艺系数(k值0.65)与数值孔径(0.65 NA),实现400nm分辨率图案化,满足RDL(重分布层)、TSV(硅通孔)等关键工序需求。XT:260通过四重相场拼接技术将单次曝光面积扩展至26mm×33mm,配合双工作台设计...
Source Link近日,光刻机巨头ASML在最新财报中宣布推出专用于3D集成的先进封装设备TWINSCAN XT:260,标志着其正式进军先进封装市场。该设备采用365nm i线光源,通过优化工艺系数(k值0.65)与数值孔径(0.65 NA),实现400nm分辨率图案化,满足RDL(重分布层)、TSV(硅通孔)等关键工序需求。XT:260通过四重相场拼接技术将单次曝光面积扩展至26mm×33mm,配合双工作台设计...
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