新思科技作为台积公司的重要合作伙伴,再次在2025年台积公司开放创新平台(OIP)生态系统论坛上荣膺六项年度合作伙伴大奖,涵盖AI辅助设计解决方案、EDA流程、射频设计迁移、Multi-Die设计测试、接口IP以及硅光电子技术等多个领域,彰显了双方在塑造半导体设计未来中的关键作用。随着AI需求增长、工艺节点不断缩小以及设计向模块化多芯片架构转变,半导体行业正经历快速变革。新思科技与台积公司的长期...
Source Link新思科技作为台积公司的重要合作伙伴,再次在2025年台积公司开放创新平台(OIP)生态系统论坛上荣膺六项年度合作伙伴大奖,涵盖AI辅助设计解决方案、EDA流程、射频设计迁移、Multi-Die设计测试、接口IP以及硅光电子技术等多个领域,彰显了双方在塑造半导体设计未来中的关键作用。随着AI需求增长、工艺节点不断缩小以及设计向模块化多芯片架构转变,半导体行业正经历快速变革。新思科技与台积公司的长期...
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