美国银行进一步看好半导体行业前景

港美通
Oct 22

10月22日,据外媒报道,美国银行近期进一步提升对芯片行业前景的乐观预期。该机构预计,随着全球对人工智能硬件需求的持续激增,到2027年全球半导体销售额将达到约1万亿美元,远超此前8600亿美元的预测。分析师指出,此次上调主要源于内存芯片(包括HBM、DRAM和NAND)及数据中心组件的强劲增长,而消费类和汽车领域的需求则相对疲软。该行预计行业销售额将在2025年攀升至7450亿美元,2026年达...

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