随着AI芯片的功耗一路狂飙,传统的散热技术正迅速逼近物理极限。在这场与“热量”的战争中,全球晶圆代工龙头台积电(TSMC)——同时也是NVIDIA GPU的核心制造商——不再满足于被动地等待第三方解决方案,而是亲自下场,拿出了一套堪称“激进”的颠覆性散热技术。根据《日经》的最新报道,台积电正全力开发一种名为“Si-integrated micro cooler (IMC-Si)”的芯片级液冷技术。...
Source Link随着AI芯片的功耗一路狂飙,传统的散热技术正迅速逼近物理极限。在这场与“热量”的战争中,全球晶圆代工龙头台积电(TSMC)——同时也是NVIDIA GPU的核心制造商——不再满足于被动地等待第三方解决方案,而是亲自下场,拿出了一套堪称“激进”的颠覆性散热技术。根据《日经》的最新报道,台积电正全力开发一种名为“Si-integrated micro cooler (IMC-Si)”的芯片级液冷技术。...
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