台积电再向海外转移先进工艺:投资日本139亿美元 生产6nm芯片

快科技
Oct 26

快科技10月26日消息,台积电近年来加大了向海外转移先进工艺的力度,在美国的投资高达1650亿美元,未来2nm以及1.4nm工艺都会在美国生产。第二个重点投资的地区就是日本,前几年在日本熊本县建设了第一座晶圆厂,主要生产28到12nm工艺的芯片,日前台积电又确认第二座晶圆厂已经达成协议,预计2027年开始运营。工厂将位于熊本一厂的东侧,建筑面积高达6.9万平方英尺,预计将贡献1700多个工作岗位,...

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