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芯片股盘初强势 中芯国际(00981)涨4.38% 我国在光刻胶领域取得新突破

金吾财讯
Oct 27

金吾财讯 | 芯片股盘初强势，截至发稿，中芯国际(00981)涨4.38%，地平线机器人-W(09660)涨4.05%，ASMPT(00522)涨3.61%，华虹半导体(01347)涨3.16%，中兴通讯(00763)涨2.77%，上海复旦(01385)涨1.29%。据科技日报报道，光刻技术是推动集成电路芯片制程工艺持续微缩的核心驱动力之一。近日，北京大学化学与分子工程学院彭海琳教授团队及合作者通过冷冻电子断层扫描技术，首次在原位状态下解析了光刻胶分子在液相环境中的微观三维结构、界面分布与缠结行为，指导开发出可显著减少光刻缺陷的产业化方案。相关论文近日刊发于《自然·通讯》。 中信建投发布研报称，随着半导体产业更先进制程迈进，芯片尺寸缩小而功率激增，“热点”问题突出，芯片表面温度过高会导致安全性和可靠性下降，催生对高效散热方案的需求。金刚石是理想散热材料，且兼具高带隙、极高电流承载能力、优异机械强度与抗辐射性，在高功率密度、高温高压等严苛场景中优势显著。其应用形式包括金刚石衬底、热沉片及带微通道的金刚石结构，可适配半导体器件、服务器GPU等核心散热需求。在制备上，化学气相沉积法(CVD)为主流，可生产单晶、多晶、纳米金刚石，国内外企业已开发相关产品。伴随算力需求提升与第三代半导体发展，未来金刚石在高端散热市场空间广阔。

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