Substrate公司研发新型光刻设备,欲挑战阿斯麦与台积电

格隆汇
Oct 28, 2025

格隆汇10月28日|一家神秘的美国初创公司正崛起,目标是挑战半导体行业的两大巨头:阿斯麦和台积电。这家公司名为Substrate,它研发了一种新型芯片制造设备,利用粒子加速来进行光刻——这是在硅晶圆上蚀刻微观电路的关键工艺。Substrate声称已解决了科技领域最棘手的问题之一,目标是与阿斯麦竞争,而阿斯麦的设备目前是制造先进处理器的唯一选择。然而,Substrate要颠覆芯片制造方式面临巨大挑战...

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